Electromagnetic shielding of plastic packaging in low-cost laser modules

被引：14

作者：

Cheng, WH ^{[1
]}

Cheng, JY

Wu, TL

Wang, CM

Wang, SC

Jou, WS

机构：

[1] Natl Sun Yat Sen Univ, Inst Electroopt Engn, Kaohsiung 80424, Taiwan

[2] Natl Sun Yat Sen Univ, Dept Elect Engn, Kaohsiung, Taiwan

[3] Chungwa Telecom Labs, Tao Yuan, Taiwan

[4] Natl Kaohsiung Inst Technol, Dept Mold & Die Engn, Kaohsiung 80782, Taiwan

来源：

ELECTRONICS LETTERS | 2000年 / 36卷 / 02期

关键词：

D O I：

10.1049/el:20000170

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Low-cost MiniDIP laser modules fabricated by plastic moulded technology filled with highly conductive materials are proposed for the evaluation of electromagnetic interference (EMI) shielding effectiveness (SE). The SE of conductive plastics was measured to be 45dB at 30MHz and 62dB at 1GHz. The laser modules have a transmission speed up to 622 Mbit/s and > 1mW fibre output power. With these excellent SEs and good optical characteristics, such plastic MiniDIP laser modules;fire suitable for use in low cost OC-12 lightwave transmission systems.

引用

页码：118 / 119

页数：2

共 4 条

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