The effects of stabilizers on the bath stability of electroless Ni deposition and the deposit

被引:99
作者
Cheong, WJ
Luan, BL [1 ]
Shoesmith, DW
机构
[1] Univ Western Ontario, Dept Chem, London, ON N6A 5B7, Canada
[2] Natl Res Council Canada, Integrated Mfg Technol Inst, London, ON N6G 4X8, Canada
基金
加拿大自然科学与工程研究理事会;
关键词
electroless nickel; stabilizers; characterization; nano-grains;
D O I
10.1016/j.apsusc.2004.02.003
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Electroless nickel (EN) deposition bath is known to have a major problem of sudden bath decomposition, which results in an increase in the operating cost of the process and the generation of environmentally hazardous waste. Bath stabilizers are normally added to extend its life. In this paper, the effects of two electroless nickel bath stabilizers; thiourea and maleic acid were investigated. The EN deposits were characterized in terms of surface morphology, microstructure, phase, and composition. It is demonstrated that the addition of thiourea and maleic acid significantly improved the stability of the EN bath. It was observed that the stabilizers have a minor and a major effect on phosphorus content and morphology of the EN deposits, respectively. It is also shown, for the first time, that the addition of the stabilizers has an effect on the nano-grain size of the EN deposit. (C) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码:282 / 300
页数:19
相关论文
共 35 条
[1]  
Abd El-Rehim S.S., 1996, MET FINISH, V94, P29, DOI [10.1016/S0026-0576(96)80087-0, DOI 10.1016/S0026-0576(96)80087-0]
[2]   Direct plating of electroless Ni-P layers on sputter-deposited Al-Ni alloy films [J].
Azumi, K ;
Yugiri, T ;
Kurihara, T ;
Seo, M ;
Habazaki, H ;
Fujimoto, S .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2003, 150 (07) :C461-C464
[3]   NICKEL PLATING ON STEEL BY CHEMICAL REDUCTION [J].
BRENNER, A ;
RIDDELL, GE .
JOURNAL OF RESEARCH OF THE NATIONAL BUREAU OF STANDARDS, 1946, 37 (01) :31-34
[4]   Effects of surfactants in an electroless nickel-plating bath on the properties of Ni-P alloy deposits [J].
Chen, BH ;
Hong, L ;
Ma, Y ;
Ko, TM .
INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH, 2002, 41 (11) :2668-2678
[5]  
Das L, 1996, PLAT SURF FINISH, V83, P55
[6]  
De Minjer C.H., 1957, PLATING, V44, P1297
[7]  
EGLI A, Patent No. 130645A2
[8]  
El-Mallah A. T., 1991, MET FINNISH, V89, P7
[9]  
FELDSTEIN N, Patent No. 5863616
[10]  
Gabrielli C., 1971, Journal of Applied Electrochemistry, V1, P167, DOI 10.1007/BF00616939