Electrical Conductive Adhesives Enhanced with High-Aspect-Ratio Silver Nanobelts

被引:33
作者
Amoli, Behnam Meschi [1 ,3 ]
Marzbanrad, Ehsan [2 ,4 ]
Hu, Anming [2 ,4 ]
Zhou, Y. Norman [2 ,3 ,4 ]
Zhao, Boxin [1 ,3 ]
机构
[1] Univ Waterloo, Dept Chem Engn, Waterloo, ON N2L 3G1, Canada
[2] Univ Waterloo, Dept Mech & Mechatron Engn, Waterloo, ON N2L 3G1, Canada
[3] Univ Waterloo, Waterloo Inst Nanotechnol, Waterloo, ON N2L 3G1, Canada
[4] Univ Waterloo, Ctr Adv Mat Joining, Waterloo, ON N2L 3G1, Canada
基金
加拿大自然科学与工程研究理事会;
关键词
electrical conductive adhesive; electrical properties; high-aspect-ratio nanofillers; hybrid composite; silver nanobelts; CARBON NANOTUBES; SURFACE; NANOPARTICLES; NANOWIRES; FILMS; WATER; GOLD;
D O I
10.1002/mame.201300295
中图分类号
T [工业技术];
学科分类号
120111 [工业工程];
摘要
The utilization of high-aspect-ratio silver nanobelts (NBs) is reported with the typical silver micro flakes to develop advanced electrical conductive adhesive (ECA) composite materials. Ag NBs (10-40 nm thick, 100-400 nm wide and 1-10 mu m long) were synthesized by chemical reduction of silver nitride. The incorporation of a small amount of the Ag NBs (NBs to flakes weight-ratio K = 0.03) into a conventional ECA with 60 wt% Ag micro flakes results in an electrical conductivity enhancement by 1300%. It is also found that adding a 2 wt% (K = 0.03) of the NBs into a conventional ECA with 80 wt% Ag flakes reduced the bulk resistivity to 3 x 10(-5) Omega . cm for the hybrid ECAs, which is comparable to that of a typical eutectic solder, showing great potential as an alternative electrical interconnect materials.
引用
收藏
页码:739 / 747
页数:9
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