Study of intermetallic growth on PWBs soldered with Sn3.0Ag0.5Cu

被引：7

作者：

Lee, M ^{[1
]}

Hwang, Y ^{[1
]}

Pecht, M ^{[1
]}

Park, J ^{[1
]}

Kim, Y ^{[1
]}

Liu, W ^{[1
]}

机构：

[1] Univ Maryland, CALCE EPSC, College Pk, MD 20742 USA

来源：

54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS | 2004年

关键词：

D O I：

10.1109/ECTC.2004.1320286

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper describes the formation of intermetallic compounds at the interface and in the bulk of Sn3.0Ag0.5Cu reflow soldered on FR-4 PWBs. One plating system is organic solderability preservative (OSP) over bare copper and the other is immersion gold over electroless nickel (Au/Ni). The paper discusses the growth of these intermetallic phases after soldering, and after aging at 100 and 1000 hours at a homologous temperature of 0.85. In order to clarify the reliability on the bond between lead free solder (Sn3.0Ag0.5Cu) and copper pad, the mechanical properties such as shear strength, hardness, and elastic modulus of the intermetallics formed at the interface on printed wiring board was also investigated.

引用

页码：1338 / 1346

页数：9

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