Solder bumping methods for flip chip packaging

被引：17

作者：

Rinne, GA

机构：

来源：

47TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1997 PROCEEDINGS | 1997年

关键词：

D O I：

10.1109/ECTC.1997.606176

中图分类号：

学科分类号：

摘要：

A survey of the flip chip industry was undertaken to investigate the various solder bumping technologies reported in the literature. The methods are classified into four main deposition categories: vapor phase, liquid phase, solid phase, and electrochemical. Theoretical and empirical evaluations of these techniques, based on work at MCNC and Unitive Electronics Inc., are provided.

引用

页码：240 / 247

页数：8