Corrosion protection of copper by a self-assembled monolayer of alkanethiol

被引:189
作者
Feng, YQ
Teo, WK
Siow, KS
Gao, ZQ
Tan, KL
Hsieh, AK
机构
[1] NATL UNIV SINGAPORE,DEPT CHEM ENGN,SINGAPORE 119260,SINGAPORE
[2] NATL UNIV SINGAPORE,DEPT PHYS,SINGAPORE 119260,SINGAPORE
关键词
D O I
10.1149/1.1837365
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
A self-assembled monolayer of 1-dodecanethiol (DT) was formed on a copper surface pretreated using different methods. The corrosion protection abilities of the monolayer were evaluated in an air-saturated 0.51 M NaCl solution using various techniques including electrochemical impedance spectroscopy, polarization, coulometry, weight loss, and x-ray photoelectron spectroscopy It was found that the corrosion resistance of the monolayer was improved markedly by using a nitric acid etching method. A minimum concentration of 10(-4) M DT was needed to form a protective monolayer. The DT-monolayer retarded the reduction of dissolved oxygen and inhibited the growth of copper oxide in the NaCl solution. In comparison with other inhibitors, such as benzotriazole (BTA) and mercapto-benzothiazole (MET), the DT-monolayer showed much better corrosion resistance in aqueous solution.
引用
收藏
页码:55 / 64
页数:10
相关论文
共 32 条
[1]  
Ateya Badr G., 1981, J. Electroanal. Chem, V117, P309, DOI [10.1016/S0022-0728(81)80091-5, DOI 10.1016/S0022-0728(81)80091-5]
[2]   ANODIC DISSOLUTION OF COPPER IN FLOWING SODIUM-CHLORIDE SOLUTIONS BETWEEN 25 DEGREES AND 175 DEGREES C [J].
BACARELLA, AL ;
GRIESS, JC .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1973, 120 (04) :459-465
[3]   FORMATION OF MONOLAYER FILMS BY THE SPONTANEOUS ASSEMBLY OF ORGANIC THIOLS FROM SOLUTION ONTO GOLD [J].
BAIN, CD ;
TROUGHTON, EB ;
TAO, YT ;
EVALL, J ;
WHITESIDES, GM ;
NUZZO, RG .
JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 1989, 111 (01) :321-335
[4]   MASS-TRANSPORT STUDY FOR THE ELECTRODISSOLUTION OF COPPER IN 1M HYDROCHLORIC-ACID SOLUTION BY IMPEDANCE [J].
BARCIA, OE ;
MATTOS, OR ;
PEBERE, N ;
TRIBOLLET, B .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1993, 140 (10) :2825-2832
[5]  
BECERRA JG, 1988, ELECTROCHIM ACTA, V33, P613
[6]  
BLACKMAN LCF, 1957, J AM CHEM SOC, V114, P171
[7]   ELECTROCHEMICAL-BEHAVIOR OF COPPER IN NEUTRAL AERATED CHLORIDE SOLUTION .1. STEADY-STATE INVESTIGATION [J].
DESLOUIS, C ;
TRIBOLLET, B ;
MENGOLI, G ;
MUSIANI, MM .
JOURNAL OF APPLIED ELECTROCHEMISTRY, 1988, 18 (03) :374-383
[8]  
DESLOUIS C, 1988, J APPL ELECTROCHEM, V16, P384
[9]   The corrosion behaviour of copper in neutral tap water .1. Corrosion mechanisms [J].
Feng, Y ;
Teo, WK ;
Siow, KS ;
Tan, KL ;
Hsieh, AK .
CORROSION SCIENCE, 1996, 38 (03) :369-385
[10]   The corrosion behaviour of copper in neutral tap water .2. Determination of corrosion rates [J].
Feng, Y ;
Teo, WK ;
Siow, KS ;
Hsieh, AK .
CORROSION SCIENCE, 1996, 38 (03) :387-395