共 10 条
[2]
EJECKAM FE, 1997, P SPIE, V2994
[3]
EJECKAM FE, 1996, 9 ANN M IEEE LAS EL
[5]
LIAO ZL, 1990, APPL PHYS LETT, V56, P737
[6]
Wafer bonding technology and its optoelectronic applications
[J].
OPTOELECTRONIC INTEGRATED CIRCUITS,
1997, 3006
:26-35