Thermal analysis of loop heat pipe used for high-power LED

被引：97

作者：

Lu, Xiang-you ^{[1
]}

Hua, Tse-Chao ^{[1
]}

Liu, Mei-jing ^{[1
]}

Cheng, Yuan-xia ^{[1
]}

机构：

[1] Shanghai Univ Sci & Technol, Sch Power Engn, Shanghai 200093, Peoples R China

来源：

THERMOCHIMICA ACTA | 2009年 / 493卷 / 1-2期

基金：

中国国家自然科学基金;

关键词：

High-power LED; Junction temperature; Loop heat pipe; Thermal resistance;

D O I：

10.1016/j.tca.2009.03.016

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

The goal of this study is to improve the thermal characteristics of high-power LED (light emitting diode) package by using a loop heat pipe. The heat-release characteristics of high-power LED package are analyzed and a novel loop heat pipe (LHP) cooling device for high-power LED is developed. The thermal capabilities, including start-up performance, temperature uniformity and thermal resistance of loop heat pipe under different heat loads and incline angles have been investigated experimentally. The obtained results indicates that the thermal resistance of the heat pipe heat sink is in the range of 0.19-3.1 K/W, the temperature uniformity in the evaporator is controlled within 1.5 degrees C, and the junction temperature of high-power LED could be controlled steadily under 100 degrees C for the heat load of 100 W. (C) 2009 Elsevier B.V. All rights reserved.

引用

页码：25 / 29

页数：5

共 9 条

[1] Chip scale thermal management of high brightness LED packages [J].

Arik, M ;

Weaver, S .

FOURTH INTERNATIONAL CONFERENCE ON SOLID STATE LIGHTING, 2004, 5530 :214-223

[2]

Arik M, 2001, ASME IEEE INT PACK T

[3] A non-contact method for determining junction temperature of phosphor-converted white LEDs [J].

Gu, YM ;

Narendran, N .

THIRD INTERNATIONAL CONFERENCE ON SOLID STATE LIGHTING, 2004, 5187 :107-114

[4] A method for projecting useful life of LED lighting systems [J].

Hong, E ;

Narendran, N .

THIRD INTERNATIONAL CONFERENCE ON SOLID STATE LIGHTING, 2004, 5187 :93-99

[5] Thermal analysis of LED array system with heat pipe [J].

Kim, Lan ;

Choi, Jong Hwa ;

Jang, Sun Ho ;

Shin, Moo Whan .

THERMOCHIMICA ACTA, 2007, 455 (1-2) :21-25

[6] Loop heat pipes [J].

Maydanik, YF .

APPLIED THERMAL ENGINEERING, 2005, 25 (5-6) :635-657

[7]

Sheu G.J., 2005, P SOC PHOTO-OPT INS, V5941, P13

[8]

Shin M.W., 2006, P SOC PHOTO-OPT INS, V6355, P9

[9] Thermal analysis of high power GaN-based LEDs with ceramic package [J].

Yang, Lianqiao ;

Jang, Sunho ;

Hwang, Woongjoon ;

Shin, Moowhan .

THERMOCHIMICA ACTA, 2007, 455 (1-2) :95-99

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