SU-8 nanocomposite photoresist with low stress properties for microfabrication applications

被引：55

作者：

Jiguet, Sebastien ^{[1
]}

Bertsch, Arnaud

Judelewicz, Moshe

Hofmann, Heinrich

Renaud, Philippe

机构：

[1] Swiss Fed Inst Technol, Lausanne, Switzerland

[2] Ecole Polytech Fed Lausanne, STI, IMM, LMIS4, CH-1015 Lausanne, Switzerland

[3] Gersteltec Sarl, CH-1004 Pully, Switzerland

[4] Ecole Polytech Fed Lausanne, STI, IMX, LTP, CH-1015 Lausanne, Switzerland

来源：

MICROELECTRONIC ENGINEERING | 2006年 / 83卷 / 10期

关键词：

nanocomposite; silica; SU-8; microfabrication;

D O I：

10.1016/j.mee.2006.02.004

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new nanocomposite photoresist based on SU-8 epoxy resin has been developed. It consists in a homogeneous dispersion of nanosilica particles in the negative tone photosensitive SU-8. The nanocomposite photoresist is more sensitive than the SU-8 photoresist and the photopatterned composite structures show low stress and less cracks than pure SU-8 structures. No significant resolution difference has been observed for both materials. (c) 2006 Elsevier B.V. All rights reserved.

引用

页码：1966 / 1970

页数：5

共 17 条

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