Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching use

被引：91

作者：

Shimizu, T

Ishikawa, H

Ohnuma, I

Ishida, K

机构：

[1] Sumitomo Met Min Co Ltd, Div Elect, Ctr Res & Dev, Ohme 1988601, Japan

[2] Tohoku Univ, Grad Sch Engn, Dept Mat Sci, Sendai, Miyagi 9808579, Japan

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1999年 / 28卷 / 11期

关键词：

Pb-free solder; Zn-based ally; die-attaching;

D O I：

10.1007/s11664-999-0153-4

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Zn-based alloys have been investigated to replace Pb-5%Sn solder for die-attaching use. We have found that a Zn-4%Al-3%Mg-3%Ga alloy has a 309 degrees C solidus and a 347 degrees C liquidus. A die-attacking test was done with preforms of this alloy, Ag-plated lead-frames, and Au-plated dummy dies. Good die-attaching with a small amount of voids can be achieved at 320 degrees C or higher. In subsequent reliability tests, no failure was observed until 1000 cycles between -65 degrees C and 150 degrees C or until 1000 h at 85 degrees C and 85% humidity. Although the poor workability and poor ability of stress relaxation at room temperature of this alloy may somewhat limit its application areas, this solder is the first Pb-free solder for die-attaching use to our knowledge.

引用

页码：1172 / 1175

页数：4