Electrochemical determination of Sn(IV)/Sn(II) ratio in tin sol formed in copper-tin sulphate solution containing laprol 2402C

被引:12
作者
Rozovskis, G [1 ]
Mockus, Z [1 ]
Pautieniene, V [1 ]
Survila, A [1 ]
机构
[1] Inst Chem, LT-2600 Vilnius, Lithuania
关键词
tin; copper; codeposition; tin sol;
D O I
10.1016/S1388-2481(01)00277-6
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The electrochemical method was applied to determine Sn(IV)/Sn(II) molar ratio in negatively charged colloid which forms in bronze plating sulphate solution containing laprol 2402C as a surface-active substance. An analysis of characteristic voltammetric minimum the onset of which is highly sensitive to Sn2+ concentration was used for this purpose. The Sn(IV)/Sn(II) ratio was found to be constant for completely formed colloid and independent on Cu(II) concentration in the solution. Particles involving Sn(IV) are supposed to be the main component responsible for stability of the sol. (C) 2002 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:76 / 79
页数:4
相关论文
共 7 条
[1]  
BOGACZ A, 1973, METALURGIA ODLEWNICT, V50, P349
[2]  
Chen WJ, 1998, J CHIN INST CHEM ENG, V29, P295
[3]   CATHODIC PROCESS IN COPPER-TIN DEPOSITION FROM SULFATE-SOLUTIONS [J].
GALDIKIENE, O ;
MOCKUS, Z .
JOURNAL OF APPLIED ELECTROCHEMISTRY, 1994, 24 (10) :1009-1012
[4]  
MEIBUHR S, 1964, ELECTROCHEM TECHNOL, V2, P267
[5]  
Rozovskii G, 1996, ZH NEORG KHIM+, V41, P53
[6]  
Rozovskis G, 2000, POL J CHEM, V74, P1665
[7]  
SURVILA A, 2001, CHEMIJA VILNIUS, V4, P241