Intermetallic compounds formed during between liquid Sn-8Zn-3Bi solders and Ni substrates

被引：39

作者：

Chiu, MY ^{[1
]}

Wang, SS ^{[1
]}

Chuang, TH ^{[1
]}

机构：

[1] Natl Taiwan Univ, Dept Mat Sci & Engn, Taipei 106, Taiwan

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2002年 / 31卷 / 05期

关键词：

Sn-8Zn-3Bi solder; nickel substrate; intermetallic compound; linear growth kinetics;

D O I：

10.1007/s11664-002-0105-8

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The morphology and growth kinetics of intermetallic compounds (IMCs) formed at the interfaces between liquid Sn-8Zn-3Bi solders and nickel substrates in the temperature range from 225degreesC to 400degreesC are investigated for the applications in bonding recycled sputtering targets to their backing plates. The results show that a continuous single layer of Ni5Zn21 IMC appears at temperatures below 325degreesC, while a double layer containing Ni5Zn21 and Ni35Zn22Sn43 IMCs is formed at temperatures above 325degreesC. In both cases, the growth kinetics of IMCs is interface-controlled. During the growth of IMCs, their reaction fronts migrate in the direction of the solder much more rapidly than toward the nickel substrate, and erosion of the Ni substrate is quite slight.

引用

页码：494 / 499

页数：6

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