Practical utilization of low melting alloy thermal interface materials

被引：28

作者：

Hill, Richard F. ^{[1
]}

Strader, Jason L. ^{[1
]}

机构：

[1] Laird Technol, Thermal Div, 4707 Detroit Ave, Cleveland, OH 44102 USA

来源：

TWENTY SECOND ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2006 | 2006年

关键词：

thermal inter-face materials; thermal resistance;

D O I：

10.1109/STHERM.2006.1625201

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

The use of low melting alloy thermal interface materials results in exceptionally low thermal resistance between heat-generating electronic components and heat removal systems. Under certain conditions, these alloys can oxidize which may lead to degradation in thermal performance. In addition, if the alloy is used in the molten state, there is a possibility of electrical shorts resulting from escaping metal. Oxidation and electrical shorts are shown to be minimized through a variety of design parameters. These include the use of oversized metal alloy TIM's that form a seal around the interface area; soldering the low melting alloys directly to the heat removal component; use of a gasket to provide a barrier to prevent air from entering the interface area and to serve as a collection vehicle for excess molten alloy; and operating below the melting point of the alloy after a "burn-in" cycle. The use of low melting alloys, in conjunction with a series of design guidelines, provides a thermal solution with improved reliability and exceptionally low thermal resistance.

引用

页码：23 / +

页数：3