Novel porous films having low dielectric constants synthesized by liquid phase silylation of spin-on glass sol for intermetal dielectrics

A novel technique for synthesis of highly porous inorganic SOG films such as aerogels using conventional spin-on processing has been developed. The porous films exhibit dielectric constants as low as 2.3 and the average pore diameter was about 80 nm. The relative dielectric constants of the films compare favorably with those of organic polymers, and the films were demonstrated to exhibit relatively low hygroscopic characteristics. This novel technique for synthesis of porous film is the first step in the development of nanofoam materials for future low k dielectrics.