Plastic deformation in thin copper films determined by x-ray micro-tensile tests

Plastic deformation in thin copper films has been studied at room temperature. Copper films having a thickness of 1 mu m were made by sputtering onto nickel substrates with a Si3N4 underlayer and with or without a Si3N4 caplayer. Deformation experiments were conducted using a special micro-tensile tester built into a theta-theta diffractometer. The problems normally associated with tension tests of free-standing films were avoided by deforming the substrate and film together. In-situ x-ray measurements of the lattice spacings and lattice spacing distributions were used to determine both elastic and plastic strains. The effects of caplayer and annealing temperature on mechanical properties are reported.