Electromagnetic simulation of bonding wires and comparison with wide band measurements

被引：33

作者：

Schuster, C ^{[1
]}

Leonhardt, G ^{[1
]}

Fichtner, W ^{[1
]}

机构：

[1] Swiss Fed Sch Technol, Dept Elect Engn, Integrated Syst Lab, CH-8092 Zurich, Switzerland

来源：

IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2000年 / 23卷 / 01期

关键词：

bonding wire; FastHenry; FDTD; Monte Carlo; package inductance;

D O I：

10.1109/6040.826764

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Several typical bonding wire configurations have been measured in a frequency range up to 20 GHz using a vector network analyzer. Based on scanning electron microscope (SEM) pictures all bonding wires have been discretized and orthogonal grids suitable for electromagnetic simulation have been generated. Full wave finite difference time domain (FDTD) simulations as well as static and quasi static inductance extraction using a new Monte Carlo technique and FastHenry as web as capacitance extraction with a finite element method have been carried out. Numerical results are compared to measured scattering parameters and their quality and frequency dependence is discussed, All simulation techniques are evaluated with respect to their computational effort.

引用

页码：69 / 79

页数：11

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