Development of fluxes for lead-free solders containing zinc

被引：66

作者：

Vaynman, S ^{[1
]}

Fine, ME ^{[1
]}

机构：

[1] Northwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USA

来源：

SCRIPTA MATERIALIA | 1999年 / 41卷 / 12期

基金：

美国国家科学基金会;

关键词：

tin-zinc eutectic; solder; flux; wetting angle;

D O I：

10.1016/S1359-6462(99)00302-4

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

A tin containing organic compound that decomposes at soldering temperatures to produce metallic tin on surfaces to be soldered can be added to the flux to improve wetting of Sn-Zn eutectic solder on Cu. It can also be used for general pretinning purposes before soldering. Several fluxes were prepared by mixing together polyvinyl acetate solution in isopropyl alcohol as a vehicle, ethanol amine, di-ethanol amine or tri-ethanol amine as activators, and tin ethylhexanoate as additive. These fluxes were evaluated in spread tests by measuring the contact angles between Sn-Zn eutectic solder and copper.

引用

页码：1269 / 1271

页数：3