Molecular dynamics simulations of heat and momentum transfer at a solid-fluid interface: Relationship between thermal and velocity slip

被引:72
作者
Khare, Rajesh
Keblinski, Pawel
Yethiraj, Arun
机构
[1] Rensselaer Polytech Inst, Dept Mat Sci & Engn, Troy, NY 12180 USA
[2] Univ Wisconsin, Dept Chem & Biol Engn, Madison, WI 53706 USA
[3] Univ Wisconsin, Dept Chem, Madison, WI 53706 USA
基金
美国国家科学基金会;
关键词
interfacial thermal resistance; velocity slip; molecular dynamics;
D O I
10.1016/j.ijheatmasstransfer.2006.03.005
中图分类号
O414.1 [热力学];
学科分类号
摘要
The thermal resistance of a model solid-liquid interface in the presence of laminar shear flow is investigated using molecular dynamics simulations. Two model liquids - a monoatomic liquid and a polymeric liquid composed of 20 repeat units - are confined between walls which are modeled as idealized lattice surfaces composed of atoms identical to the monomers. We find that in the absence of a velocity slip (discontinuity) at the solid-fluid interface, the mass flow does not affect the thermal interfacial resistance, but the presence of velocity slip results in an increase in the interfacial thermal resistance by about a factor of two. (c) 2006 Elsevier Ltd. All rights reserved.
引用
收藏
页码:3401 / 3407
页数:7
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