Mobility degradation of inversion layer carriers due to MERIE-type plasma action

被引:7
作者
Atanassova, E
Paskaleva, A
机构
[1] Institute of Solid State Physics, Bulgarian Academy of Sciences, 1784 Sofia
关键词
D O I
10.1016/0038-1101(96)00003-2
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The influence of a MERIE-type plasma on the oxide and the interface properties of thin (11 nn) Si-SiO2 structures has been investigated by means of the inversion channel I-V characteristics of a gateless FET. It has been established that the plasma action leads to a degradation of the inversion carrier mobility and to a change of the dominant scattering mechanism in the inversion channel. The reason for this is found to be the generation of a large amount of charges in the form of a positive oxide charge and negatively charged acceptor-like interface states. The exact energy position of these states depends on the plasma conditions. We propose that plasma induced interface states are mainly attributed to VUV and ion bombardment, whereas the high values of the positive oxide charge are due to the charging effect. The oxide charge is associated with E' centers and the interface states with P-b centers, respectively. Copyright (C) 1996 Elsevier Science Ltd.
引用
收藏
页码:1033 / 1041
页数:9
相关论文
共 26 条
  • [1] THIN-OXIDE MOS DAMAGE CAUSED BY WAFER CHARGING IN MAGNETIZED HELIUM PLASMA
    ATANASSOVA, E
    [J]. THIN SOLID FILMS, 1995, 264 (01) : 72 - 81
  • [2] CREATION OF DEEP GAP STATES IN SI DURING CL2 OR HBR PLASMA ETCH EXPOSURES
    AWADELKARIM, OO
    GU, T
    DITIZIO, RA
    MIKULAN, PI
    FONASH, SJ
    REMBETSKI, JF
    CHAN, YD
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1993, 11 (04): : 1332 - 1336
  • [3] CHANG KP, 1994, J APPL PHYS, V75, P4415
  • [4] FANG S, 1991, MATER RES SOC S P, V265, P231
  • [5] FANG S, 1992, IEEE ELECT DEVICE LE, V15, P288
  • [6] A MODEL AND EXPERIMENTS FOR THIN OXIDE DAMAGE FROM WAFER CHARGING IN MAGNETRON PLASMAS
    FANG, SC
    MCVITTIE, JP
    [J]. IEEE ELECTRON DEVICE LETTERS, 1992, 13 (06) : 347 - 349
  • [7] GABRIEL CT, 1992, SOLID STATE TECHNOL, V35, P81
  • [8] GATE OXIDE DAMAGE FROM POLYSILICON ETCHING
    GABRIEL, CT
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1991, 9 (02): : 370 - 373
  • [9] MAGNETRON ETCHING OF POLYSILICON - ELECTRICAL DAMAGE
    GREENE, WM
    KRUGER, JB
    KOOI, G
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1991, 9 (02): : 366 - 369
  • [10] GRISCOM DL, 1989, PHYSICS CHEM SIO2 SI, P287