Growth of silicon carbide nanoparticles using tetraethylorthosilicate for microelectromechanical systems

被引:6
作者
DelRio, Frank W. [1 ]
Dunn, Martin L.
de Boer, Maarten P.
机构
[1] Univ Colorado, Dept Mech Engn, Boulder, CO 80309 USA
[2] Sandia Natl Labs, MEMS Devices & Reliabil Phys Dept, Albuquerque, NM 87185 USA
关键词
D O I
10.1149/1.2364380
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Silicon carbide (SiC) is a wide bandgap semiconductor of interest in microelectromechanical systems. We demonstrate the growth of SiC nanoparticles using silicon dioxide (SiO2) films deposited from tetraethylorthosilicate [TEOS, Si(OC2H5)(4)]. High-temperature annealing allows residual carbon to diffuse to and react with the silicon substrate to form SiC nanoparticles (rather than a uniform SiC film). The growth of the SiC nanoparticles can be controlled by annealing conditions or eliminated by flowing oxygen during the film deposition. These particles are revealed by a standard wet etchant and provide an effective method to reduce adhesion between micromachined surfaces. (c) 2006 The Electrochemical Society.
引用
收藏
页码:H27 / H30
页数:4
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