Electroceramic materials

被引:367
作者
Setter, N [1 ]
Waser, R
机构
[1] Swiss Fed Inst Technol, EPFL, Ceram Lab, CH-1015 Lausanne, Switzerland
[2] Forschungszentrum Julich, D-52425 Julich, Germany
[3] Rhein Westfal TH Aachen, D-52056 Aachen, Germany
关键词
ceramics; functional; electrical properties; electroceramics;
D O I
10.1016/S1359-6454(99)00293-1
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Electroceramics research is driven by technology and device applications. This growing field includes a vast number of magnetic, dielectric, ionically conducting, semiconducting, and superconducting ceramics used in domains as diverse as transportation, industrial production, power engineering, medicine and health care, consumer electronics, and communication. Al the turn of the decade, three major trends are gaining importance: Materials integration issues play an increasingly important role driven by the interest in integrating electroceramic functions into conventional semiconductor chips as well as by the evolution of multifunctional components and systems. The industrial production process currently is in a transition from empirical studies and physical demonstrators into virtual design and testing. To fit into this evolution, for integrated as well as for discrete electroceramic components, a rise in modeling and numerical simulation of material- and device-related properties presently occurs. Electroceramic materials are following in the footsteps of conventional semiconductors with respect to further miniaturization, and are experiencing the same evolution:from microtechnology towards nanotechnology. Nanosize effects and nanotechnology issues are therefore gaining importance. In the context of these three issues, we discuss the research in electroceramics during the last decade and basic trends for the future. (C) 2000 Published by Elsevier Science Ltd on behalf of Acta Metallurgica Inc. All rights reserved.
引用
收藏
页码:151 / 178
页数:28
相关论文
共 257 条
[61]   Process integration of embedded FeRAMs [J].
de Araujo, CAP ;
Solayappan, N ;
McMillan, LD ;
Otsuki, T ;
Arita, K .
JOURNAL OF ELECTROCERAMICS, 1999, 3 (02) :135-142
[62]   A STRUCTURAL MODEL FOR THE RELAXOR PBMG1/3NB2/3O3 AT 5-K [J].
DEMATHAN, N ;
HUSSON, E ;
CALVARIN, G ;
GAVARRI, JR ;
HEWAT, AW ;
MORELL, A .
JOURNAL OF PHYSICS-CONDENSED MATTER, 1991, 3 (42) :8159-8171
[63]  
Dennard Robert H., 1968, U.S. Patent, Patent No. 3387286
[64]   THEORY OF THE DIELECTRIC CONSTANTS OF ALKALI HALIDE CRYSTALS [J].
DICK, BG ;
OVERHAUSER, AW .
PHYSICAL REVIEW, 1958, 112 (01) :90-103
[65]   Leakage currents in Ba0.7Sr0.3TiO3 thin films for ultrahigh-density dynamic random access memories [J].
Dietz, GW ;
Schumacher, M ;
Waser, R ;
Streiffer, SK ;
Basceri, C ;
Kingon, AI .
JOURNAL OF APPLIED PHYSICS, 1997, 82 (05) :2359-2364
[66]   Composite piezoelectric transducer with truncated conical endcaps ''cymbal'' [J].
Dogan, A ;
Uchino, K ;
Newnham, RE .
IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 1997, 44 (03) :597-605
[67]  
Dubois M.-A., 1998, Integrated Ferroelectrics, V22, P535, DOI 10.1080/10584589808208072
[68]  
Dubois MA, 1998, ULTRASON, P909, DOI 10.1109/ULTSYM.1998.762291
[69]   Properties of aluminum nitride thin films for piezoelectric transducers and microwave filter applications [J].
Dubois, MA ;
Muralt, P .
APPLIED PHYSICS LETTERS, 1999, 74 (20) :3032-3034
[70]   Structure and composition of grain boundaries in ceramics [J].
Ernst, F ;
Kienzle, O ;
Rühle, M .
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 1999, 19 (6-7) :665-673