A high-speed hybrid-integrated two-channel laser diode (LD) array module has been fabricated using a silica-based planar lightwave circuit (PLC) platform, A laser diode array was flip-chip bonded on a PLC platform using AuSn solder bumps. The module showed a wide 3dB bandwidth of 10GHz, which is wide enough for operation at 10Gbit/s.
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页码:2232 / 2233
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JACKSON KP, 1992, P ELECTR C, P93, DOI 10.1109/ECTC.1992.204190