Morphology of copper coatings electroplated in an ultrasonic field

被引:17
作者
Martins, L
Martins, JI
Romeira, AS
Costa, ME
Costa, J
Bazzaoui, M
机构
[1] Univ Porto, Fac Engn, Dept Engn Electrotecn, CISE, P-4200465 Oporto, Portugal
[2] Univ Porto, Fac Engn, Dept Engn Quim, P-4200465 Oporto, Portugal
来源
ADVANCED MATERIALS FORUM II | 2004年 / 455-456卷
关键词
copper; electrodeposition; adhesion; hardness; ultrasound;
D O I
10.4028/www.scientific.net/MSF.455-456.844
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper reports the study of ultrasonic effects on some physicochemical properties of electroplated copper on iron subtracts from an acid sulphate bath. The bath efficiency for three stirring processes has been also studied as a function of the time and the current density applied. The bath efficiency, the hardness, the brightness and the adherence of the electrodeposits increase with the ultrasonic agitation, in comparison with the same coatings produced from still or magnetic stirred baths. Scanning electron microscopy (SEM) analysis has revealed a compact and more order structure in the coatings performed under ultrasonic waves at high current densities, conversely to free and dusty obtained with still bath.
引用
收藏
页码:844 / 848
页数:5
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