Advanced flip-chip solder bonding

被引：5

作者：

Humpston, G

Needham, AP

机构：

[1] GEC Marconi Materials Technology Ltd, Northamptonshire

来源：

NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT | 1997年 / 395卷 / 03期

关键词：

D O I：

10.1016/S0168-9002(96)01239-9

中图分类号：

TH7 [仪器、仪表];

学科分类号：

0804 ; 080401 ; 081102 ;

摘要：

Flip-chip solder bonding is becoming the established method for interconnection of high performance semiconductor devices. It is used for the assembly of pixelated detectors, multi-chip modules (MCMs) and monolithic microwave integrated circuits (MMICs). The process has self-aligning features that result in closely dimensioned and highly reproducible array interconnections.

引用

页码：375 / 378

页数：4