Selective Electroless Copper Deposition on Self-Assembled Dithiol Monolayers

被引：55

作者：

Aldakov, Dmitry

Bonnassieux, Yvan

Geffroy, Bernard ^{[2
]}

Palacin, Serge ^{[1
]}

机构：

[1] CEA Saclay, DSM, IRAMIS, SPCSI, F-91191 Gif Sur Yvette, France

[2] Ecole Polytech, CEA LITEN, LPICM, F-91128 Palaiseau, France

来源：

ACS APPLIED MATERIALS & INTERFACES | 2009年 / 1卷 / 03期

关键词：

electroless deposition; self-assembled monolayers; copper vias; dithiols; microcontact printing; palladium nanoparticles; METAL-DEPOSITION; GOLD; SURFACES; METALLIZATION; FILMS; 1,8-OCTANEDITHIOL; ALKANEDITHIOLS; NANOPARTICLES; 1-OCTANETHIOL; MULTILAYERS;

D O I：

10.1021/am8001346

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The paper reports the use of self-assembled monolayers (SAMS) of dithiols to induce elcctroless copper deposition on a gold substrate. The metallization catalyst, palladium nanoparticles, is bound on the dithiol SAM. The assembly process is followed by I R and X-ray photoelectron spectroscopies to confirm the formation of a monolayer with bound catalyst. Electroless metallization is then carried out with a steady deposition rate of 130 nm/min. Additionally, microcontact printing of the catalyst on the SAM by poly(dimethylsiloxane) stamps is used to localize copper deposits. Resulting metallization is selective and allows for a high resolution.

引用

收藏

页码：584 / 589

页数：6

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