Bleaching-induced changes in the dispersion curves of DNQ photoresists

被引:11
作者
Henderson, CL
Willson, CG
Dammel, RR
Synowicki, RA
机构
来源
ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XIV | 1997年 / 3049卷
关键词
photoresist; lithography simulation; refractive index; index of refraction; Cauchy parameters; spectroscopic ellipsometry; bleaching; Dill parameters; standing wave;
D O I
10.1117/12.275861
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Three sets of data are required to model a non-chemically amplified photoresist: the exposure eor ABC (Dill) parameters, the development parameters, and the refractive index. The refractive index of photoresists has often been considered constant in simulations and other work. However, the refractive index can change as the chemical composition of the photoresist is modified during the exposure reaction. This work presents a study of the refractive index as a function of exposure for a series of commercial, non-chemically amplified DNQ/novolak photoresists using spectroscopic ellipsometry. It was found that the real part of the refractive index for a photoresist changes by as much as 5% at the wavelength of exposure, in part due to the resist bleaching which removes the anomalous dispersion contributions to the refractive index. A discussion of the impact of such refractive index changes on Dill parameter extraction and the simulation of standing wave patterns will be presented.
引用
收藏
页码:585 / 595
页数:11
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