Bond strength, bond stress and spallation mechanisms of thermal barrier coatings

被引:130
作者
Gell, M [1 ]
Jordan, E
Vaidyanathan, K
McCarron, K
Barber, B
Sohn, YH
Tolpygo, VK
机构
[1] Univ Connecticut, Dept Met & Mat Engn, Storrs, CT 06269 USA
[2] Univ Connecticut, Dept Engn Mech, Storrs, CT 06269 USA
[3] Univ Calif Santa Barbara, Dept Mat Sci & Engn, Santa Barbara, CA 93106 USA
关键词
D O I
10.1016/S0257-8972(99)00338-2
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Five production thermal barrier coatings were thermally cycled between room temperature and 1121 degrees C (2050 degrees F) to determine relative spallation life. Bond strength measurements were made using a modified ASTM direct pull-test. Bond stress measurements were made in the thermally grown oxide using a laser photoluminescence technique. Bond strength and bond stress measurements were conducted on two electron beam physical vapor deposition coatings as a function of thermal cycling. Each coating showed characteristic values of as-coated strength and stress and changes in strength and stress with thermal cycling. These variations in strength and stress with thermal cycling are related to oxidation and micro-debonding effects. (C) 1999 Elsevier Science S.A. All rights reserved.
引用
收藏
页码:53 / 60
页数:8
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