The ultra clean sputtering process and high density magnetic recording media

被引:38
作者
Takahashi, M
Kikuchi, A
Kawakita, S
机构
[1] Dept. of Electronics Engng, Faculty of Engng, Tohoku University, Sendai
关键词
D O I
10.1109/20.617804
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The ultra clean sputtering process (UC-process) was newly introduced in the fabrication of CoNiCr and CoCrTa thin film media to establish the new concept of controlling the microstructure and magnetic properties. The relation between cleanness during film deposition process and magnetic properties has been discussed in connection with their microstructure. The UC-process here presented enables the control of the fine structure of the thin film media and resulted in excellent magnetic properties. This study demonstrates that the UC-process is very superior to the normal process presently used and plays a dominant role for the thin film media fabrication.
引用
收藏
页码:2938 / 2943
页数:6
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