Thermal simulation of surface micromachined polysilicon hot plates of low power consumption

被引：17

作者：

Dumitrescu, M

Cobianu, C

Lungu, D

Dascalu, D

Pascu, A

Kolev, S

van den Berg, A

机构：

[1] Inst Microtechnol, Bucharest 77550, Romania

[2] Politehn Univ Bucharest, Mech Fac, Bucharest, Romania

[3] Univ Sofia, Fac Chem, BU-1126 Sofia, Bulgaria

[4] Univ Twente, Fac Elect Engn, MESA Res Inst, NL-7500 AE Enschede, Netherlands

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 1999年 / 76卷 / 1-3期

关键词：

thermal simulation; surface micromachining; polysilicon membrane; micro hot plate;

D O I：

10.1016/S0924-4247(99)00042-4

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A simple, IC compatible, surface micromachined polysilicon membrane was technologically designed and thermally simulated by 3D finite element 'COSMOS' program in order to investigate its capability to work as a micro hot plate for a gas sensing test structure of low power consumption. For an optimized layout based on four 'poly' suspended bridges and a central 'poly' pillar supporting the 110 X 110 mu m(2) 'poly' membrane separated from the silicon substrate by 1 mu m of air gap, temperatures as high as 673 K were obtained for an input power of 100 mW. (C) 1999 Elsevier Science S.A. All rights reserved.

引用

页码：51 / 56

页数：6