共 20 条
[3]
Cure of hydrogen silsesquioxane for intermetal dielectric applications
[J].
LOW-DIELECTRIC CONSTANT MATERIALS III,
1997, 476
:37-44
[4]
CASE C, 1997, MRS S P, V476
[5]
Chemical-mechanical polishing of low dielectric constant poly(silsesquioxane): HSQ
[J].
JOURNAL OF POLYMER RESEARCH-TAIWAN,
1999, 6 (03)
:197-202
[7]
Effects of slurry formulations on chemical-mechanical polishing of low dielectric constant polysiloxanes: hydrido-organo siloxane and methyl silsesquioxane
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B,
2000, 18 (01)
:201-207
[8]
CHIANG C, 1998, MRS S P, V511