Variation of polish pad shape during pad dressing

被引：41

作者：

Zhou, YY ^{[1
]}

Davis, EC ^{[1
]}

机构：

[1] MEMC SW Inc, Sherman, TX USA

来源：

MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY | 1999年 / 68卷 / 02期

关键词：

silicon wafer; polish pad; pad dressing;

D O I：

10.1016/S0921-5107(99)00423-7

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In silicon wafer polishing and CMP processes, polish pad dressing (conditioning) is often used to restore pad performance. In this report, variation of polish pad shape during dressing is studied by using diamond-plated cup wheels and sandpaper rings, respectively. Result shows that pad shape becomes concave after certain amount of dressing. The concavity increases with dressing time - longer dressing produces higher concavity. Moment induced by the frictional force between pad and dressing device is proposed to explain the pad shape variation. (C) 1999 Elsevier Science S.A. All rights reserved.

引用

页码：91 / 98

页数：8

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