共 21 条
[1]
ADAMS VH, 1997, P PAC RIM ASME INT I, P1967
[2]
PACKAGE THERMAL-RESISTANCE MODEL - DEPENDENCY ON EQUIPMENT DESIGN
[J].
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY,
1988, 11 (04)
:528-537
[3]
[Anonymous], ADV TRANSPORT PHENOM
[4]
[Anonymous], 1995, EIAJESD512 JEDEC
[5]
[Anonymous], MECH MEASUREMENT
[6]
[Anonymous], 1980, SERIES COMPUTATIONAL, DOI [DOI 10.1201/9781482234213, 10.1201/9781482234213]
[7]
Compact thermal models of packages used in conduction cooled applications
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
2000, 23 (03)
:470-480
[8]
BEJAN A, 1995, CONVENTION HEAT TRAN
[9]
Blevins R. D., 1992, APPL FLUID DYNAMICS
[10]
EWES I, 1995, P EUROTHERM SEM

