A novel input-side current sensing method to achieve AVP for future VRs

被引:24
作者
Sun, Julu [1 ]
Zhou, Jinghai
Xu, Ming
Lee, Fred C.
机构
[1] Virginia Polytech Inst & State Univ, Ctr Power Elect Syst, Blacksburg, VA 24061 USA
[2] Maxim Integrated Prod, Sunnyvale, CA 94086 USA
基金
美国国家科学基金会;
关键词
adaptive voltage position (AVP); voltage regulator (VR);
D O I
10.1109/TPEL.2006.880347
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper begins with a review of different current sensing methods for the voltage regulator (VR) to achieve adaptive Voltage position (AVP). These methods are either inaccurate or with high power consumption for current sensing. Next, a new input-side current sensing method for AVP is proposed. The basic idea of the proposed method is to sense the average input current, which results in low power dissipation for current sensing. Meanwhile, a compensation circuit is proposed to eliminate current sensing errors due to input and output voltage variations. As a result, both low power dissipation and good current sensing accuracy can be achieved by applying the proposed method. The transient and tolerance analysis of this method are provided and a design guideline is illustrated and experimentally verified.
引用
收藏
页码:1235 / 1242
页数:8
相关论文
共 11 条
[1]  
*INT, 2005, ISL6560 INT
[2]  
*INT CORP, 2005, VOLT REG DOWN VRD 10
[3]  
KERN F, 2003, P INT TECHN S SEP, P1
[4]   Analysis and interpretation of loop gains of multiloop-controlled switching regulators [J].
Ridley, Raymond B. ;
Cho, Bo H. ;
Lee, Fred C.Y. .
IEEE Transactions on Power Electronics, 1988, 3 (04) :489-498
[5]   A New, Continuous-Time Model For Current-Mode Control [J].
Ridley, Raymond B. .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 1991, 6 (02) :271-280
[6]  
Tang W., 1993, IEEE Transactions on Power Electronics, V8, P112, DOI 10.1109/63.223961
[7]  
TANG W, 1992, IEEE POWER ELECTRON, P503, DOI 10.1109/PESC.1992.254839
[8]   Resonant free power network design using extended adaptive voltage positioning (EAVP) methodology [J].
Waizman, A ;
Chung, CY .
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2001, 24 (03) :236-244
[9]  
Yao KW, 2004, APPL POWER ELECT CO, P272
[10]  
Zhang M., 2000, P KOOL CHIPS WORKSH, V133, P1