Utilization of wastepaper to manufacture low density boards

Shredded newspaper, magazine, and office wastepaper, bonded with urea-formaldehyde (UF) and tannin paraformaldehyde (TP) adhesives both at 8% and 12% of resin solid contents, based on oven-dried weight of particles, were used to produce low-density boards in a series of laboratory scale experiments. Physical, mechanical and dimensional stability properties were analyzed according to ASTM D 1037-91. The target board density and thickness were 0.6 g/cm(3) and 0.8 cm, respectively. Office wastepaper and newspaper UF and TP-bonded boards, at 12% resin level, had the best mechanical properties. Office wastepaper boards also exhibited the best thickness swelling properties. The dimensional stability properties of UF-bonded boards were better than the TP-bonded boards. In general, as resin level increased from 8% to 12% both MOR and MOE values increased. A comparison between UF and TP-bonded boards showed that the former performed better, at the same resin level. (C) 2000 Elsevier Science Ltd. All rights reserved.