Obtaining of high surface roughness copper deposits by electroless plating technique

被引：40

作者：

Norkus, E ^{[1
]}

Vaskelis, A ^{[1
]}

Jaciauskiene, J ^{[1
]}

Stalnioniene, I ^{[1
]}

Stalnionis, G ^{[1
]}

机构：

[1] Inst Chem, Dept Catalysis, LT-01108 Vilnius, Lithuania

来源：

ELECTROCHIMICA ACTA | 2006年 / 51卷 / 17期

关键词：

copper; electroless deposition; surface roughness; thallium UPD; copper(II) ligands;

D O I：

10.1016/j.electacta.2005.09.043

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The use of pyridine-2,6-dicarboxylic and 4-hydroxypyridine-2,6-dicarboxylic acids as copper(II) ligands in formaldehyde-containing alkaline electroless copper plating solutions allowed to obtain copper layers with extremely high surface roughness factor reaching approximately 120. The Cu deposits of higher surface area were formed at highly negative open-circuit (mixed) potentials; the correlation between copper electrode overpotential and roughness of the deposit was found and discussed. The copper films obtained demonstrate a high electrocatalytic activity in anodic formaldehyde oxidation process, the oxidation rate reaches 40 mA cm(-2) and exceeds considerably that for other copper surfaces. (c) 2005 Elsevier Ltd. All rights reserved.

引用

页码：3495 / 3499

页数：5

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