Reactive microspheres as active fillers for epoxy resins

被引:20
作者
Carfagna, C
Ambrogi, V
Cicala, G
Pollicino, A
Recca, A
Costa, G
机构
[1] Univ Naples Federico II, Dept Mat & Prod Engn, I-80125 Naples, Italy
[2] Univ Catania, Dept Phys & Chem Methodol Engn, I-95125 Catania, Italy
[3] CNR, IMAG, I-16149 Genoa, Italy
关键词
adhesion; crosslinking; curing of polymers; resins; thermosets;
D O I
10.1002/app.20678
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
Physical properties of epoxy resins filled with microparticles are presented and discussed. Microparticles were synthesized in the form of micron-sized, crosslinked spherical particles, with an excess of reactive amino groups on their outer surface, and subsequently blended with EPON828-3,3'DDS in different weight percents (10 and 20 wt %). Differential scanning calorimetry and scanning electronic microscopy were applied to investigate microsphere properties such as morphology, shape, size, and size distribution. Electron spectroscopy for chemical analysis was applied on particles to relate surface composition and reactivity of microspheres. Rheological, dynamic-mechanical, and mechanical properties of the cured blends were analyzed and related to the pure resin and to the same resin modified with PES180. (C) 2004 Wiley Periodicals, Inc.
引用
收藏
页码:2031 / 2044
页数:14
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