Micromirror arrays fabricated by flip-chip assembly

被引：18

作者：

Michalicek, MA ^{[1
]}

Zhang, WG ^{[1
]}

Harsh, KF ^{[1
]}

Bright, VM ^{[1
]}

Lee, YC ^{[1
]}

机构：

[1] Univ Colorado, Dept Mech Engn, NSF Ctr Adv Mfg & Packaging Microwave Opt & Digit, Boulder, CO 80309 USA

来源：

MINIATURIZED SYSTEMS WITH MICRO-OPTICS AND MEMS | 1999年 / 3878卷

关键词：

D O I：

10.1117/12.361291

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents the design, fabrication, modeling, and testing of several Flexure-Beam Micromirror Device (FBMD) arrays fabricated using flip-chip assembly. These arrays were prefabricated using a silicon surface-micromachining technology and then transferred to a ceramic receiving substrate using a thin layer of indium placed between the bond pads of the two chips. Device characterization was completed using an interferometric microscope in which micromirror deflection was determined as a function of address potential. The arrays demonstrate reasonable micromirror performance with optically flat surfaces measuring only 5-6 nm of variance across as much as a 150 mu m mirror surface.

引用

页码：68 / 79

页数：12

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