Chemically modified boron nitride-epoxy terminated dimethylsiloxane composite for improving the thermal conductivity

被引：219

作者：

Kim, Kiho ^{[1
]}

Kim, Myeongjin ^{[1
]}

Hwang, Yongseon ^{[1
]}

Kim, Jooheon ^{[1
]}

机构：

[1] Chung Ang Univ, Sch Chem Engn & Mat Sci, Seoul 156756, South Korea

来源：

CERAMICS INTERNATIONAL | 2014年 / 40卷 / 01期

基金：

新加坡国家研究基金会;

关键词：

Composites; Thermal conductivity; Nitrides; Surface treatment; ALUMINUM; FILMS; POLYIMIDE; OXIDE;

D O I：

10.1016/j.ceramint.2013.07.117

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The thermal conductivities of composites with an epoxy-terminated dimethylsiloxane (ETDS) matrix and boron nitride (BN) powder fillers were investigated. Two surface curing agents, 3-glycidoxypropyltrimethoxysilane (KBM-403) and 3-chloropropyltrimethoxysilane (KBM-703), were doped onto the surfaces of hydroxyl-functionalized boron nitride using a simple sol gel process to act as fillers in the thermally conducting composites. These synthesized materials were embedded in epoxy resin via a solvent casting method. The surface modification had an appreciable effect on the thermal conductivity resulting in increased thermal conductivity up to 70 wt%. The thermal conductivities of the composites containing 70 wt% BN particles treated with the KBM-403 and KBM-703 curing agents were 4.11 and 3.88 W/mK, respectively, compared to 2.92 W/mK for the composite without surface treatment. (C) 2013 Elsevier Ltd and Techna Group S.r.l. All rights reserved.

引用

页码：2047 / 2056

页数：10

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