The processing of liquid crystalline polymer printed circuits

被引:21
作者
Farrell, B [1 ]
St Lawrence, M [1 ]
机构
[1] Foster Miller Inc, Waltham, MA USA
来源
52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS | 2002年
关键词
D O I
10.1109/ECTC.2002.1008168
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
After many years of development, Liquid Crystalline Polymer materials are finally ready for significant use as a printed circuit board material. These materials have always had very attractive electrical and physical properties but were a challenge to be made into industry acceptable circuit boards. Through extensive technology development efforts by Foster-Miller to develop biaxially oriented LCP film, producing high quality substrates is now possible and are available from Rogers. As with all new substrate materials, a set of appropriate circuit fabrication processes must be selected to support this new material set. This paper addresses some of these processes.
引用
收藏
页码:667 / 671
页数:3
相关论文
共 9 条
[1]  
BLIZARD KK, 1990, INT POLYM PROCESSING, V53
[2]  
FARRELL B, 1997, 16 DIG AV SYST C IRV
[3]  
JAYARAJ K, 1998, ADV MICROELECTRONICS, V25
[4]  
JAYARAJ K, INTERPACK 97
[5]  
LAWRENCE M, IMAPS 99
[6]  
NOLL T, 1996, P INT C MULT MOD DEN
[7]  
NOLL T, 1996, 20 ANN ANT APPL S 19
[8]  
*SBIR, DAAH0100CR066 SBIR
[9]  
TANAKA Y, 1999, J JAPANESE SOC ELECT, V2