A 120-W X-band spatially combined solid-state amplifier

被引：99

作者：

Cheng, NS ^{[1
]}

Jia, PC

Rensch, DB

York, RA

机构：

[1] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA

[2] HRL Labs LLC, Malibu, CA 90265 USA

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 1999年 / 47卷 / 12期

关键词：

finline structure; solid-state power amplifier; spatial power combining;

D O I：

10.1109/22.809006

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, we present new results in the development of a broad-band spatial power-combining system implemented in a standard X-band waveguide environment. Using 24 off-the-shelf GaAs monolithic-microwave integrated-circuit (MMIC) power amplifiers integrated with tapered-slot antenna arrays, the new combining circuit produced up to 126-W maximum power output with a gain variation of +/-1.9 dB within the band of interest (8-11 GHz), This hybrid circuit combiner is transparent to the device technology, and also provides an excellent heat-sinking capacity, sustaining as much as 415 W of de power consumed by the MMIC amplifiers. The modular architecture allows easy maintenance, variable output power level, and modular assembly. Results on graceful degradation are also presented, showing superb tolerance to device failure.

引用

页码：2557 / 2561

页数：5

共 5 条

[1]

ALEXANIAN A, 1997, IEEE MTT S INT MICR, V3, P1139

[2]

[Anonymous], 1998, U.S. Patent, Patent No. [5 736 908, 5736908]

[3]

Cheng NS, 1998, IEEE AP-S, P466, DOI 10.1109/APS.1998.699179

[4] 40-W CW broad-band spatial power combiner using dense finline arrays [J].

Cheng, NS ;

Alexanian, A ;

Case, MG ;

Rensch, DB ;

York, RA .

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1999, 47 (07) :1070-1076

[5]

CHENG NS, 1998, IEEE MTT S INT MICR, V3, P1457

← 1 →