Nano-imprint lithography using replicated mold by Ni electroforming

被引:51
作者
Hirai, Y
Harada, S
Isaka, S
Kobayashi, M
Tanaka, Y
机构
[1] Univ Osaka Prefecture, Grad Sch, Dept Mech Syst Engn, Sakai, Osaka 5998531, Japan
[2] Hikifune Co Ltd, Div Res & Dev, Tokyo 1240014, Japan
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 2002年 / 41卷 / 6B期
关键词
imprint lithography; mold; replica; electroforming; Ni; electroless plating; surface roughness;
D O I
10.1143/JJAP.41.4186
中图分类号
O59 [应用物理学];
学科分类号
摘要
In nano-imprint lithography. durability of the mold is one of the most important factors for industrial application. We demonstrate replicated mold fabrication for integrated fine patterns based on a Si/SiO2 master mold. The replication is performed by Ni electroless plating and a Ni electroforming process for a 1 in.(2) field. Fine patterns as small as 250 nm in width and 270 nm in height have been successfully replicated without fatal defects such as cracks or voids. Using the replicated mold, fine patterns have been successfully obtained by imprint lithography. The surface roughness of the replicated mold is relatively poor compared with that of the master mold because of the micrograms of the Ni electroless plating. layer, However, the quantitative values of the surface roughness of both the replicated mold and the imprinted resist are small for practical usage.
引用
收藏
页码:4186 / 4189
页数:4
相关论文
共 6 条
[1]   Nanoimprint lithography [J].
Chou, SY ;
Krauss, PR ;
Renstrom, PJ .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1996, 14 (06) :4129-4133
[2]  
Colbum M., 1999, P SOC PHOTO-OPT INS, V3676, P378
[3]  
HERZING H, 1997, MICRO OPTICS
[4]  
Hirai Y., 2001, Journal of Photopolymer Science and Technology, V14, P457, DOI 10.2494/photopolymer.14.457
[5]   Fabrication of T gate structures by nanoimprint lithography [J].
Macintyre, DS ;
Chen, Y ;
Lim, D ;
Thoms, S .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2001, 19 (06) :2797-2800
[6]  
Palermo P., 1977, Optics and Laser Technology, V9, P169, DOI 10.1016/0030-3992(77)90058-5