Simple and fast organic device encapsulation using polyisobutene

被引：20

作者：

Toniolo, R ^{[1
]}

Hümmelgen, IA ^{[1
]}

机构：

[1] Univ Fed Parana, Dept Fis, BR-81531990 Curitiba, Parana, Brazil

来源：

MACROMOLECULAR MATERIALS AND ENGINEERING | 2004年 / 289卷 / 04期

关键词：

conjugated polymers; degradation; encapsulation; light-emitting diodes (LED);

D O I：

10.1002/mame.200300329

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

We demonstrate the use of polyisobutene (PIB) in a glass encapsulation method suitable for organic devices. The PIB viscosity at environmental temperatures provides a fast and non-aggressive passivant layer formation method for device protection with glass. Due to its fully aliphatic character, PIB is suitable for passivating organic light-emitting and photovoltaic devices. The observed preservation of encapsulated Ca films demonstrates the PIB suitability for air-unstable metals passivation. Stable I(V) characteristics and increased operational lifetime were observed in PIB-encapsulated organic devices. This encapsulation method is cheap, simple, and dispenses intensive equipment use, so that it is appropriate even for laboratories with restricted experimental facilities.

引用

页码：311 / 314

页数：4

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