Evaluation of thermal deformation in electronic packages

被引：2

作者：

Beom, HG ^{[1
]}

Jeong, KM ^{[1
]}

机构：

[1] Chonnam Natl Univ, Dept Mech Engn, Coll Engn, Kwangju 500757, South Korea

来源：

KSME INTERNATIONAL JOURNAL | 2000年 / 14卷 / 02期

关键词：

thermal deformation; electronic package; warpage; laminated plate theory; analytic solution;

D O I：

10.1007/BF03184791

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

Thermal deformation in an electronic package due to thermal strain mismatch is investigated. The warpage and the in-plane deformation of the package after encapsulation is analyzed using the laminated plate theory. An exact solution for the thermal deformation of an electronic package with circular shape is derived. Theoretical results are presented on the effects of the layer geometries and material properties on the thermal deformation. Several applications of the exact solution to electronic packaging product development are illustrated. The applications include lead on chip package, encapsulated chip on board and chip on substrate.

引用

页码：251 / 260

页数：10

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