A comparative study of the coated filler method and the admixture method of powder metallurgy for making metal-matrix composites

被引:37
作者
Yih, P
Chung, DDL
机构
[1] Compos. Mat. Research Laboratory, State Univ. of New York at Buffalo, Buffalo
关键词
D O I
10.1023/A:1018624517297
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Copper-matrix composites were made by powder metallurgy (PM). The reinforcements were molybdenum particles, silicon carbide whiskers and titanium diboride platelets. The coated filler method, which involves a reinforcement coated with the matrix metal, was used. In contrast, conventional PM uses the admixture method, which involves a mixture of matrix powder and reinforcement. For all the composite systems,the coated filler method was found to be superior to the admixture method in providing composites with lower porosity, greater hardness, higher compressive yield strength, lower coefficient of thermal expansion (CTE), higher thermal conductivity and lower electrical resistivity, though the degree of superiority was greater for high than low reinforcement contents. In the coated filler method, the coating on the reinforcement separated reinforcement units from one another and provided a cleaner interface and stronger bond between reinforcement and matrix than the admixture method could provide. The highest reinforcement content attained in dense composites (<5% porosity) made by the coated filler method was 70 vol % Mo, 60 vol % TiB2 and 54 vol % SiC. The critical reinforcement volume fraction above which the porosity of composites made by the admixture method increases abruptly is 60% Mo, 42% TiB2 and 33% SiC. This fraction increases with decreasing aspect ratio of the reinforcement. Among Cu/Mo, Cu/TiB2 and Cu/SiC at the same reinforcement volume fraction (50%), Cu/Mo gave the lowest CTE, highest thermal conductivity and lowest electrical resistivity, while Cu/SiC gave the greatest hardness and Cu/TiB2 and Cu/SiC gave the highest compressive yield strength. Com pared to Cu/SiC, Cu/TiB2 exhibited much higher thermal conductivity and much lower electrical resistivity.
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页码:2873 / 2882
页数:10
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