共 4 条
Stability of bare and copper-laminated YBCO samples:: Experimental & simulation results
被引:33
作者:
Kim, HM
[1
]
Jankowski, J
Lee, H
Bascuñán, J
Fleshler, S
Iwasa, Y
机构:
[1] MIT, Francis Bitter Natl Magnet Lab, Cambridge, MA 02139 USA
[2] MIT, Dept Mech Engn, Cambridge, MA 02139 USA
[3] Amer Superconductor Corp, Westborough, MA 01581 USA
关键词:
copper lamination;
liquid nitrogen nucleate boiling;
stability of coated YBCO;
D O I:
10.1109/TASC.2004.830556
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
In this study of stability of YBCO composite, we investigate quench/recovery behavior of YBCO test samples, bare and copper-laminated, by subjecting each test sample, immersed in a bath of liquid nitrogen boiling at 77.3 K, to a transport current pulse superimposed to a baseline DC current of 90-95% the critical current. The current pulse has an amplitude up to similar to4.5 times the critical current and a duration of 300 ms. This paper presents both experimental and simulation results showing that composite YBCO tape that incorporates a copper lamina stabilizes and to a degree protects the conductor against large over-current pulses.
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页码:1290 / 1293
页数:4
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