Cathodic debond of anodically bonded silicon to glass wafers

被引：7

作者：

Plaza, JA ^{[1
]}

González, E

Esteve, J

Visser, MM

Wang, DT

Hanneborg, A

机构：

[1] Univ Autonoma Barcelona, Ctr Nacl Microelect, Dept Silicon Technol & Microsyst, E-08193 Barcelona, Spain

[2] SINTEF, Elect & Cybernet, N-0314 Oslo, Norway

来源：

ELECTROCHEMICAL AND SOLID STATE LETTERS | 2000年 / 3卷 / 08期

关键词：

D O I：

10.1149/1.1391157

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The bond quality of anodically bonded wafers was studied after reversing the current through the bonded interface. After a cathodic process the bond quality decreased with increasing reverse current. The degradation of the bond depended on the glass quality and on the original bond. Pyrex no. 7740 and Hoya SD-2 glass wafers were tested. (C) 2000 The Electrochemical Society. S1099-0062(00)05-023-9. All rights reserved.

引用

收藏

页码：392 / 394

页数：3

相关论文

共 9 条

[1] IRREVERSIBILITY OF ANODIC BONDING [J].

ALBAUGH, KB .

MATERIALS LETTERS, 1986, 4 (11-12) :465-469

[2] ELECTRODE POLARIZATION IN ALKALI-CONTAINING GLASSES [J].

CARLSON, DE ;

STOCKDALE, GF ;

HANG, KW .

JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1972, 55 (07) :337-+

[3] LOW ENERGY METAL-GLASS BONDING [J].

DENEE, PB .

JOURNAL OF APPLIED PHYSICS, 1969, 40 (13) :5396-&

[4] Fabrication of a silicon-Pyrex-silicon stack by ac anodic bonding [J].

Despont, M ;

Gross, H ;

Arrouy, F ;

Stebler, C ;

Staufer, U .

SENSORS AND ACTUATORS A-PHYSICAL, 1996, 55 (2-3) :219-224

[5]

Harz M., 1992, Journal of Micromechanics and Microengineering, V2, P161, DOI 10.1088/0960-1317/2/3/007

[6] HIGH-ASPECT-RATIO ALIGNED MULTILAYER MICROSTRUCTURE FABRICATION [J].

LEE, KY ;

RISHTON, SA ;

CHANG, THP .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1994, 12 (06) :3425-3430

[7] An integrated resonant accelerometer microsystem for automotive applications [J].

Ohlckers, P ;

Holm, R ;

Jakobsen, H ;

Kvisteroy, T ;

Kittilsland, G ;

Larsen, A ;

Nese, M ;

Nilsen, SM ;

Ferber, A .

SENSORS AND ACTUATORS A-PHYSICAL, 1998, 66 (1-3) :99-104

[8] Nondestructive anodic bonding test [J].

Plaza, JA ;

Esteve, J ;

LoraTamayo, E .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1997, 144 (05) :L108-L110

[9] FIELD ASSISTED GLASS-METAL SEALING [J].

WALLIS, G ;

POMERANT.DI .

JOURNAL OF APPLIED PHYSICS, 1969, 40 (10) :3946-&