Simulation of thermally induced package effects with regard to piezoresistive pressure sensors

被引：11

作者：

Schilling, F ^{[1
]}

Langheinrich, W ^{[1
]}

Weiblen, K ^{[1
]}

Arand, D ^{[1
]}

机构：

[1] ROBERT BOSCH GMBH,DEPT K8 ESE4,D-72762 REUTLINGEN,GERMANY

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 1997年 / 60卷 / 1-3期

关键词：

piezoresistive sensors; pressure sensors; sensor packaging; thermal effects;

D O I：

10.1016/S0924-4247(96)01419-7

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Microsystems are on their way out of laboratories into production. One of these microsystems, a piezoresistive pressure sensor developed by Robert Bosch GmbH, is examined within this paper. Obviously, one can detect undesirable temperature effects resulting from the sensor package, which influence the electrical characteristics of the sensor, By means of finite-element modelling (FEM), a simulation of the temperature effects can be managed. It is also possible to search for alternative designs of the sensor package.

引用

页码：37 / 39

页数：3