Influence of air exposures and thermal treatments on the secondary electron yield of copper

被引:57
作者
Bojko, I
Hilleret, N
Scheuerlein, C [1 ]
机构
[1] CERN, EST Div, Surfaces & Mat Grp, CH-1211 Geneva 23, Switzerland
[2] CERN, LHC Div, Vacuum Grp, CH-1211 Geneva, Switzerland
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 2000年 / 18卷 / 03期
关键词
D O I
10.1116/1.582286
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The variation of the secondary electron yield (SEY) of sputter-cleaned oxygen-free high-conductivity copper has been studied as a function of air exposure duration at room temperature. After short air exposures of some seconds the maximum SEY (delta(max)) of clean copper is reduced from 1.3 to less than 1.2, due to the oxidation of the copper surface. Prolonged air exposure increases the SEY steadily until, after about 8 days of atmospheric exposure, delta(max) is higher than 2. Air exposures at higher temperatures have been found to be effective in reducing the SEY of technical copper surfaces. A 5 min air exposure of copper at 350 degrees C followed by a 350 degrees C bakeout under vacuum reduces delta(max) to about 1.05, which is lower than the value of pure copper and that of Cu2O. (C) 2000 American Vacuum Society. [S0734-2101(00)04103-8].
引用
收藏
页码:972 / 979
页数:8
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