A power-optimal repeater insertion methodology for global interconnects in nanometer designs

被引:198
作者
Banerjee, K [1 ]
Mehrotra, A
机构
[1] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA
[2] Univ Illinois, Comp & Syst Res Lab, Urbana, IL 61801 USA
关键词
buffer insertion; delay optimization; leakage power; low-power design; power modeling and optimization; RC interconnects; repeaters; short-circuit power; very large-scale integration (VLSI);
D O I
10.1109/TED.2002.804706
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper addresses the problem of power dissipation during the buffer insertion phase of interconnect performance optimization. It is shown that the interconnect delay is actually very shallow with respect to both the repeater size and separation close to the minimum point. A methodology is developed to calculate the repeater size and interconnect length which minimizes the total interconnect power dissipation for any given delay penalty. This methodology is used to calculate the power-optimaI buffering schemes for various ITRS technology nodes for 5% delay penalty. Furthermore, this methodology is also used to quantify the relative importance of the various components of the power dissipation for power-optimal solutions for various technology nodes.
引用
收藏
页码:2001 / 2007
页数:7
相关论文
共 17 条
[1]   Repeater design to reduce delay and power in resistive interconnect [J].
Adler, V ;
Friedman, EG .
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 1998, 45 (05) :607-616
[2]  
Bakoglu H., 1990, CIRCUITS INTERCONNEC
[3]   3-D ICs: A novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration [J].
Banerjee, K ;
Souri, SJ ;
Kapur, P ;
Saraswat, KC .
PROCEEDINGS OF THE IEEE, 2001, 89 (05) :602-633
[4]   Accurate analysis of on-chip inductance effects and implications for optimal repeater insertion and technology scaling [J].
Banerjee, K ;
Mehrotra, A .
2001 SYMPOSIUM ON VLSI CIRCUITS, DIGEST OF TECHNICAL PAPERS, 2001, :195-198
[5]   Analysis of on-chip inductance effects for distributed RLC interconnects [J].
Banerjee, K ;
Mehrotra, A .
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2002, 21 (08) :904-915
[6]  
Banerjee K., 1999, Proceedings 1999 Design Automation Conference (Cat. No. 99CH36361), P885, DOI 10.1109/DAC.1999.782207
[7]  
Chandrakasan A.P., 1995, Low Power Digital CMOS Design
[8]  
CONG J, 1998, P INT S PHYS DES, P45
[9]  
De V., 1999, Proceedings. 1999 International Symposium on Low Power Electronics and Design (Cat. No.99TH8477), P163, DOI 10.1109/LPE.1999.799433
[10]  
GELSINGER PP, 2001, P IEEE INT SOL STAT, P22