Surface passivation of n-type crystalline Si by plasma-enhanced-chemical-vapor-deposited amorphous SiCx:H and amorphous SiCxNy:H films

被引:41
作者
Martín, I [1 ]
Vetter, M [1 ]
Orpella, A [1 ]
Voz, C [1 ]
Puigdollers, J [1 ]
Alcubilla, R [1 ]
机构
[1] Univ Politecn Cataluna, Dept Elect Engn, ES-08034 Barcelona, Spain
关键词
D O I
10.1063/1.1527230
中图分类号
O59 [应用物理学];
学科分类号
摘要
Excellent passivation of n-type crystalline silicon surface is demonstrated by means of intrinsic amorphous silicon carbide (a-SiCx:H) thin films. An optimum CH4/SiH4 ratio is determined, leading to an effective surface recombination velocity, S-eff, lower than 54 cm s-1. By adding a constant flow of N-2 to the precursor gases, the surface passivation is improved to S(eff)less than or equal to16 cm s(-1). From infrared spectroscopy measurements of these films, it can be deduced that the N-2 flow increases the carbon content of the layers for a constant CH4/SiH4 ratio. The dependence of the effective lifetime, tau(eff), on the excess charge carrier density, Deltan, is measured using the quasisteady-state photoconductance technique, and these curves are simulated through an electrical model based on an insulator/semiconductor structure. (C) 2002 American Institute of Physics.
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页码:4461 / 4463
页数:3
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